Merits of DO-218AB SM6S:

1.?DO-218AB?SM6S, with larger size of chip, owns strong ability of reverse surge.

2. High surge capability

3. High production efficiency with short lead time.

4. Stable and reliable under various natural environments.

5. Competitive cost with high-level quality.

6. Rounded angle in Chip’s design.

7. PN junction is secured by solid wrap of PI glue.

Procedures of chip’s production

1. Automatic Printing（Ultra-precise automatic wafer printing）

2. Automatic First-etching?（Automatic Etching Equipment，CPK>1.67）

3. Automatic Polarity Test（Precise Polarity Test）

4. Automatic Assembly （Self-developed Automatic Precise Assembly）

5. Soldering (Protection with Mixture of Nitrogen & Hydrogen

Vacuum Soldering )

6. Automatic Second-etching?(Automatic Second-etching with Ultra-pure Water)

7. Automatic Gluing?(Uniform Gluing & Precise Calculation are Realized by Automatic Precise Gluing Equipment)

8. Automatic Thermal Test?(Automatic Selection by Thermal Tester)

9. Automatic Test(Multifunctional Tester)